Apparatus for chemical mechanical polishing

Details Apparatus for chemical mechanical polishing Apparatus for chemical mechanical polishing

2006-12-05

2006-12-05

Ackun, Jr., Jacob K. (Department: 3723)

Abrading

Machine

Rotary tool

C451S388000, C451S397000

Reexamination Certificate

active

07144308

ABSTRACT:
Apparatus for chemical mechanical polishing are disclosed. A disclosed apparatus includes a polishing station having a polishing pad, a gas supplier to generate pressurized gas to press a wafer toward the polishing pad, and a polishing head assembly including a planar member having a plurality of fine holes in communication with the gas supplier and a membrane to press the wafer toward the polishing pad due to the pressurized gas received through the plurality of fine holes, wherein the plurality of fine holes are arranged to rotate at different radii of rotation when the planar member rotates.

REFERENCES:
patent: 6837774 (2005-01-01), Hu et al.
patent: 6872258 (2005-03-01), Park et al.
patent: 2005/0136806 (2005-06-01), Boo et al.

Affiliated with

Also associated with

Rating

Apparatus for chemical mechanical polishing does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for chemical mechanical polishing, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for chemical mechanical polishing will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3710359