Apparatus for calibrating surface mounting processes in printed

Details Apparatus for calibrating surface mounting processes in printed Apparatus for calibrating surface mounting processes in printed

1997-07-17

1999-08-24

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

With testing, measuring, and/or indicating means

73150, 734321, 156 64, 156358, G01B 2108, B32B 3100

Patent

active

059420782

ABSTRACT:
An apparatus for calibrating surface mounting processes in the manufacturing of printed circuit board assemblies. In one embodiment of the invention, a test pad of adhesive is deposited onto a substrate, and then a test module is mounted to the substrate at the test pad. The test module is representative of an electrical component that is to be mounted to a printed circuit board, and the test module is mounted to the substrate in a manner in which the electrical component is to be mounted to a printed circuit board. After the test module is mounted to the substrate, the profile of the test pad is detected through the substrate and/or the test module to determine whether the test pad contacts enough of the test module to sufficiently adhere the test module to the substrate without interfering with the terminals of the test module. Accordingly, this embodiment of the invention provides an indication or estimate of the desired volume of an adhesive pad to mount a specific component to a PCB.

REFERENCES:
patent: 5237622 (1993-08-01), Howell
patent: 5247844 (1993-09-01), Howell
patent: 5537204 (1996-07-01), Woodhouse
patent: 5662763 (1997-09-01), Yamanaka

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