Apparatus for bump-plating semiconductor wafers

Details Apparatus for bump-plating semiconductor wafers Apparatus for bump-plating semiconductor wafers

1977-09-12

1979-02-06

Kaplan, Morris

Coating apparatus

With means to apply electrical and/or radiant energy to work...

Electrostatic and/or electromagnetic attraction or...

118 64, B05B 502, B05C 500

Patent

active

041378679

ABSTRACT:
An apparatus for bump-plating on one surface of a semiconductor wafer, in which the upper surface of a horizontally set semiconductor wafer that is not to be plated has a gas, blown thereon preferably with an inert gas, and the lower surface of the wafer is contacted with plating liquid that is blown vertically upward, to thereby prevent the non-plated surface from being contacted by with the plating liquid without usage of any coatings such as photoresist to being applied thereon so as to facilitate the bump-plating of semiconductor wafers.

REFERENCES:
patent: 2953483 (1960-09-01), Torok
patent: 3417734 (1968-12-01), Simm et al.
patent: 3435802 (1969-04-01), Nail
patent: 3557752 (1971-01-01), Hakanson
IBM Technical Disclosure Bulletin, "Cooling Ion-Implantation Target" Hammer, vol. 19, No. 6 (Nov. 1976) pp. 2270-2271.

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