Apparatus for bump-plating semiconductor wafers

Details Apparatus for bump-plating semiconductor wafers Apparatus for bump-plating semiconductor wafers

1978-04-04

1979-10-16

Welsh, John D.

Coating apparatus

With means to apply electrical and/or radiant energy to work...

Electrostatic and/or electromagnetic attraction or...

118 64, 118500, B05C 502

Patent

active

041709594

ABSTRACT:
An apparatus for applying a bump-plating on one surface of a semiconductor wafer, which comprises a plurality of cup-shaped plating basins and a plurality of holders, each of the holders being engageable with a relevant one of the basins to set a semiconductor wafer horizontally, in which the underside of the wafer is contacted with plating liquid vertically blown up, the respective plating basins having an annular protrusion provided on the inner peripheral surface thereof to thereby bias internally a portion of plating liquid blown up along the inner surface of the plating basin so as to contact uniformly the plating liquid to the underside of the wafer as well as to average electric field density applied on the wafer surface.

REFERENCES:
patent: 4008683 (1977-02-01), Rose
patent: 4075974 (1978-02-01), Plows et al.

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