Apparatus for breaking semiconductor wafers and the like

Details Apparatus for breaking semiconductor wafers and the like Apparatus for breaking semiconductor wafers and the like

1985-04-25

1987-03-31

Yost, Frank T.

Severing by tearing or breaking

Breaking or tearing apparatus

Movable breaking tool

125 23R, 225103, B26F 300

Patent

active

046536809

ABSTRACT:
Apparatus and method for breaking a scribed semiconductor wafer and the like. The apparatus includes a wafer support which is movable with respect to a breaker arm having a knife-edge. The breaker arm is actuated pneumatically or by other similar means to impart a shock or impulse to the wafer along each of the wafer scribe lines so as to fracture the wafer. A control mechanism is provided for automatically alternately stepping the wafer position with respect to the breaker arm and actuating the breaker arm. Once the entire wafer has been broken along one axis, the wafer is rotated ninety degrees and the sequence is repeated along the other axis.

REFERENCES:
patent: 3497948 (1970-03-01), Wiesler et al.
patent: 3562057 (1971-02-01), McAlister et al.
patent: 3565306 (1971-02-01), St Louis
patent: 3570733 (1971-03-01), Allen
patent: 3687345 (1972-08-01), Carlson et al.
patent: 3790051 (1974-02-01), Moore
patent: 4068788 (1978-01-01), Gubitose et al.

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