Apparatus for breaking and separating dies from a wafer

Details Apparatus for breaking and separating dies from a wafer Apparatus for breaking and separating dies from a wafer

1997-09-11

1999-11-09

Rachuba, M.

Severing by tearing or breaking

Breaking or tearing apparatus

Including means to apply thermal shock to work

225 2, 225103, 225 965, B26F 300, H01L 2178

Patent

active

059797282

ABSTRACT:
An apparatus for breaking a wafer into individual devices. An anvil 100 is pressed against a flexible membrane 304 on which a wafer 300 is attached. A vacuum is applied to the anvil 100 which allows the flexible membrane 304 and the wafer 300 to be pressed against the face of the anvil 100. As the flexible membrane 304 is deformed against the anvil 100, the wafer 300 breaks into individual devices 302. Dicing debris that is created when the wafer 300 is broken falls into a base fixture 408 so that the debris does not contact and damage the devices 302.

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