Apparatus for bonding with a meltable composition

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Automatic and/or material-triggered control

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Details

156359, 1563796, 1563798, 156550, 156578, 156539, 198789, 226152, B32B35/00

Patent

active

059024453

ABSTRACT:
A machine for applying a heat meltable composition includes a drive module, a light source module, and a nozzle module. The drive module attaches to the end of an elongate arm for moving the material with respect to the nozzle. The light module includes a laser for irradiating the composition as it passes through the nozzle and is applied to the material. The nozzle includes a mechanism for withdrawing the composition after flow is terminated to prevent the formation of strings in the composition. The modules are controlled by a process that provides a sequence of steps upon receipt of control signals from an operator foot pedal.

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patent: 5356062 (1994-10-01), Kato
patent: 5693177 (1997-12-01), Meltzer et al.

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