Apparatus for bonding layers of resinous material

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With cutting – punching – piercing – severing – or tearing

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Details

1565801, 156583, B32B 3100

Patent

active

040594785

ABSTRACT:
A method and apparatus for bonding at least two films of resinous material such as polyester films to one another wherein at least a portion of one surface of one polyester film is placed contiguous with at least a portion of one surface of the other polyester films adjacent thereto. At least one layer of resinous material such as a layer of polyester is placed adjacent each of the other surfaces of the polyester films to be bonded and opposite the contiguous portions of the surfaces. The contiguous portions of the polyester films to be bonded are compressed against one another by pressure applied to the two outermost layers of polyester. The temperature of the contiguous portions along their interface is raised at least to a bonding temperature of the polyester by energy transmitted through the layers of polyester on each side of the two polyester films. When the energy, and subsequently the pressure, are removed from the polyester films, a bond is formed between the contiguous surfaces of the polyester films.

REFERENCES:
patent: 2584633 (1952-02-01), Southwick
patent: 2833683 (1958-05-01), Quandt
patent: 2963072 (1960-12-01), Swartz
patent: 3331719 (1967-07-01), Soloff
patent: 3547753 (1970-12-01), Sutton
patent: 3729357 (1973-04-01), Swartz
patent: 3817802 (1974-06-01), Meyer

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