Apparatus for bonding external leads of an integrated circuit

Details Apparatus for bonding external leads of an integrated circuit Apparatus for bonding external leads of an integrated circuit

1992-02-18

1994-10-25

Evans, Geoffrey S.

Electric heating

Metal heating

For bonding with pressure

219 8516, 228 447, B23K 3047

Patent

active

053591704

ABSTRACT:
A hot bar apparatus for effecting solder bonds for high density electronic components has a diamond or diamond-like (i.e. a generally diamond crystal lattice with graphite impurities) surface that makes contact with the leads of the electronic component and transmits the heat necessary to effect a solder bond. The diamond or diamond-like surface has superior wear characteristics over any other material, and it also is an electrical insulator to protect the electronic components from spurious voltages and currents generated by electrical currents that provide the heat for the hot bar.

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