Apparatus for bonding a semiconductor die to a package using a g

Details Apparatus for bonding a semiconductor die to a package using a g Apparatus for bonding a semiconductor die to a package using a g

1992-10-08

1993-11-09

Rosenbaum, Mark

Metal fusion bonding

With means to cool work or product

219388, 219486, 228232, B23K 304

Patent

active

052595455

ABSTRACT:
An Au/Si die attach method for attaching a die to a package including preheating the package, melting Au/Si preform in the package cavity, scratching the die onto the package cavity to form a die attach bond, and gradually cooling an Au/Si die bond by reducing heat supplied the package, so as to cool the package through a monotonically decreasing sequence of temperatures, where the package is maintained for a predetermined period of time at each temperature in the sequence. A heating block with segments supplies a decreasing amount of heat to the packages to let the die attach bond gradually cool. The packages are kept on top of the segments of the heating block for a predetermined period of time and each segment is heated to a specific temperature. The gradual cooling of the die attach bond decreases the thermal resistance and prevents the creation of voids in the die attach bond.

REFERENCES:
patent: 3756489 (1973-09-01), Chartet
patent: 4771018 (1988-09-01), Bhattacharyya et al.
patent: 4810671 (1989-03-01), Bhattacharyya et al.
IBM Technical Disclosure Bulletin, vol. 33, No. 1A, Jun. 1990, p. 308.
Mahalingam, M. et al., "Thermal Effect of Die Bond Voids," Semiconductor International, Sep. 1984, pp. 71-79.
Huang, C. C. and N. K. Sharma, "Thermal Enhancement Methods for ECL Gate Array Packaging," IEEE Semiconductor Thermal and Temperature Measurement Symposium, Proceedings 1988, pp. 78-83.

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