Apparatus for bonding a low density material to a plastic substr

Details Apparatus for bonding a low density material to a plastic substr Apparatus for bonding a low density material to a plastic substr

1989-02-10

1990-04-24

Simmons, David

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

Automatic and/or material-triggered control

156362, 156553, 156556, 156581, B32B 3116

Patent

active

049197460

ABSTRACT:
An apparatus for and a method of bonding low density or thin gauge polyurethane foams to polypropylene substrates, said apparatus including, a revolvable turntable for indexing the workpieces to various work stations, a conductive heating station to heat-liquify designated areas of the polypropylene substrate, and a compression station having compression platens to emboss the polyurethane foam onto the polypropylene substrate effectively fusing the fibers of the polyurethane foam with the heat-liquified areas of polypropylene. The method generally includes the steps of, engaging the surface of a precut polypropylene substrate with a heated member for a predetermined period of time to cause the polypropylene to heat-liquify at the points of contact forming a raised quantity of melted polypropylene, removing the heated member from contact with the polypropylene, placing a pre-cut sheet of polyurethane foam into contact with the melted polypropylene, applying pressure to the polyurethane foam so as to fuse the fibers thereof with the melted polypropylene, and permitting the fused polyurethane and polypropylene to cool effectively bonding them together.

REFERENCES:
patent: 2306256 (1942-12-01), Wickwire et al.
patent: 3962007 (1976-06-01), Heimberger
patent: 4310377 (1982-01-01), Lorenz
patent: 4798639 (1989-01-01), Yamaguchi

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