Apparatus for bevelling wafer-edge

Details Apparatus for bevelling wafer-edge Apparatus for bevelling wafer-edge

1993-11-24

1996-07-23

Kisliuk, Bruce M.

Abrading

Machine

Rotary tool

451 5, B24B 500

Patent

active

055384633

ABSTRACT:
An apparatus for bevelling the edge of a wafer, comprising a framework, a table rotatably mounted to the framework and capable of holding down the wafer, a buff rotatably mounted to the framework opposite the table and having a formed groove for bevelling the wafer edge, an air cylinder assembly mounted to the framework and pressing the buff by different forces on the orientation flat, the circular edge and the round joints of the wafer held down by the table, a sensor sensing the orientation flat, the circular edge and the round joints of the wafer held down by the table and producing corresponding signals, and a control controlling the air cylinder assembly to select between the forces in response to the signals. The apparatus may comprise a grooving cutter assembly removably held by the table, a lock locking the rotation of the table when the apparatus produces the formed groove in the buff, and a stopper stopping the air cylinder assembly and positioning the cutter assembly relative to the buff.

REFERENCES:
patent: 3325946 (1967-01-01), Lange
patent: 3798843 (1974-03-01), Weatherell
patent: 4286415 (1981-09-01), Loreto
patent: 4638601 (1987-01-01), Steere
patent: 4693038 (1987-09-01), Vetter
patent: 4999954 (1991-03-01), Miyamoto
patent: 5094037 (1992-03-01), Hakomori et al.
patent: 5177901 (1993-01-01), Smith
patent: 5258823 (1993-11-01), Akamatsu

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