Apparatus for baking resist on semiconductor wafers

Details Apparatus for baking resist on semiconductor wafers Apparatus for baking resist on semiconductor wafers

1981-05-15

1985-05-21

Mayewsky, Volodymyr Y.

Electric heating

Heating devices

Combined with container, enclosure, or support for material...

219462, 219460, 432 11, 432121, F27B 906, F27D 1102

Patent

active

045188483

ABSTRACT:
In the resist baking apparatus disclosed herein, heating of the wafer is effected by direct contact with a thin disc-like heating plate whose heat capacity is not greatly disparate from that of the wafer. The heating plate is initially brought to a temperature higher than that which is to be applied to the resist but the corresponding cooling of the plate as the wafer is initially heated prevents damaging temperatures from reaching the resist. The heater plate is perforate and air pressure is utilized to support a wafer over the heater plate before heating is to begin and also to later lift the wafer and thereby sharply define the end of heating. During baking, a vacuum is applied through these same perforations to clamp the wafer tightly against the heating plate for tight thermal coupling.

REFERENCES:
patent: 3870460 (1975-03-01), Flint
patent: 3947236 (1976-03-01), Lasch, Jr.
Boomhower et al., IBM Technical Disclosure Bulletin, "Heated Base Airtrack Tool System for Heated Media or Reactive Wafer Transport/Processing", pp. 2946-2948, vol. 19, No. 8, Jan. 1977, 219-388.

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