Apparatus for automatically taping electronic components

Details Apparatus for automatically taping electronic components Apparatus for automatically taping electronic components

1989-03-01

1990-09-04

Ball, Michael W.

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

With work feeding or handling means

53591, 1984771, 221 74, B65H 526

Patent

active

049542079

ABSTRACT:
A method and apparatus for handling electronic components. The method includes: (a) advancing an elongated support member in a first direction; (b) automatically extracting electronic components from the elongated support member in a second direction while the elongated support member is advancing in the first direction, the second direction being substantially perpendicular to the first direction; and (c) placing the electronic components on an elongated first tape and applying a second tape to the first tape to fix the electronic components between the tapes. The spacing between the electronic components within the support assembly and the spacing between the electronic components fixed between the tapes may be different. A sensor may be provided to sense the presence or absence of an electronic component within the apparatus.

REFERENCES:
patent: 3421284 (1969-01-01), Zemek
patent: 3669309 (1972-06-01), Romeo
patent: 4447287 (1984-05-01), Hofbauer
patent: 4737227 (1988-04-01), Foster et al.

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