Apparatus for automatically mounting special-type chips on subst

Metal working – Means to assemble or disassemble – Means to assemble electrical device

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29837, B23P 1900

Patent

active

046777458

ABSTRACT:
An apparatus for automatically mounting special-type chips on a substrate which is capable of individually and successively mounting special-type chips on a substrate at a high speed. The apparatus comprises a chip feed and removing mechanism for individually and successively feeding chips to a chip fitting mechanism, the chip fitting mechanism including a single mounting head and adapted to accurately position terminal pins of a chip with respect to a substrate, and a chip terminal clinching mechansim for cutting and bending the terminal pins to securely mount the chip on the substrate.

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patent: 4161064 (1979-07-01), Woodman, Jr. et al.
patent: 4196513 (1980-04-01), Harigane et al.
patent: 4293998 (1981-10-01), Kawa et al.
patent: 4387506 (1983-06-01), Wright et al.
patent: 4422232 (1983-12-01), Vancelette et al.

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