Apparatus for automatically mounting electronic components

Metal working – Means to assemble or disassemble – With means to test work or product

Patent

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Details

29714, 29740, H05K 330

Patent

active

050881876

ABSTRACT:
An improved apparatus for automatically mounting electronic components includes a take-out nozzle which is rotated by a nozzle rotating unit based on data on an angular position assumed by each chip-shaped electronic component firmly held on the take-out nozzle, in order to perform a correcting operation so as to allow the electronic component to assume an adequate angular position and, after completion of the correction operation, the respective electronic components are mounted on a printed-circuit board. The apparatus includes a storing unit in which an allowable error range is stored, a comparing unit for determining whether or not the present angular positions assumed by the respective electronic components and recognized by a recognized unit remain within the allowable error range, and a controlling unit for controlling the nozzle rotating unit so as to allow a correcting operation to be repeatedly performed based on results derived from the determination made by the comparing unit, until the respective recognized angular positions remain within the allowable error range.

REFERENCES:
patent: 4628464 (1986-12-01), McConnell
patent: 4653664 (1987-03-01), Hineno et al.
patent: 4675993 (1987-06-01), Harada
patent: 4747198 (1988-05-01), Asai et al.
patent: 4793707 (1988-12-01), Hata

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