Apparatus for automatically mounting chip-type circuit elements

Metal working – Means to assemble or disassemble – Means to assemble electrical device

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Details

29417, 29832, 29593, H05K 300, H05K 100, H05K 330

Patent

active

045934622

ABSTRACT:
An apparatus for automatically mounting chip-type circuit elements on a substrate for a printed circuit board is disclosed which is capable of overcoming the problem of suction failure and wrong posture of a circuit element to efficiently carry out the mounting operation of the elements on a substrate. The automatic mounting apparatus includes a detecting device for detecting a defect such as a failure in suction of a circuit element by a mounting head and/or the wrong posture of a circuit element sucked up and a rotating disk controllably actuated to allow a mounting head other than that relating to the defect to suck up a circuit element of the same kind from tape feeders and mount it on the substrate after the detecting device detects the defect.

REFERENCES:
patent: 3473212 (1969-10-01), Beck et al.
patent: 3499203 (1970-03-01), Clark et al.
patent: 3499204 (1970-03-01), Drop
patent: 4135630 (1979-01-01), Snyder et al.
patent: 4151945 (1979-05-01), Ragard et al.
patent: 4372802 (1983-02-01), Harigane et al.
patent: 4473247 (1984-09-01), Itemadani et al.

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