Apparatus for automatically mounting a plurality of semiconducto

Details Apparatus for automatically mounting a plurality of semiconducto Apparatus for automatically mounting a plurality of semiconducto

1993-03-02

1999-02-16

Sells, James

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

Automatic and/or material-triggered control

156542, 156556, 29739, 29742, B32B 3100

Patent

active

058716106

ABSTRACT:
Lead frames supplied from a first supply unit are intermittently conveyed in a non-oxidizing atmosphere. An adhesive is supplied from a second supply unit onto islands of the lead frames, and also semiconductor chips are supplied from a third supply unit onto the islands. When one of different kinds of semiconductor chips supplied from the third supply unit is selected, the selected semiconductor chip is held by a holder having a configuration adapted to the selected semiconductor chip. Therefore, transfer means for semiconductor chips includes at least two kinds of holders.

REFERENCES:
patent: 3909933 (1975-10-01), Doubek, Jr. et al.
patent: 4511421 (1985-04-01), Kuehn et al.
patent: 4855007 (1989-08-01), Baxte et al.
patent: 4858308 (1989-08-01), Komori

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