Apparatus for automatic soldering

Electric heating – Metal heating – For bonding with pressure

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Details

219 85R, B23K 112

Patent

active

047884037

ABSTRACT:
An apparatus for the automatic soldering of lead pins distributed on a packaged IC chip in bilateral or quadrilateral parallel rows, to corresponding contact pins which are distributed on a substrate printed circuit board in rows corresponding to said rows of lead pins and have preliminarily been pasted with solder. The packaged IC chip is placed on the substrate board, and the packaged IC chip is positioned to align each lead pin in the rows on the packaged IC chip with a corresponding contact pin in the rows on the substrate board. The lead pin together with the contact pin aligned therewith is then exposed to iradiation by a heat ray emitted from a heat ray soldering head and focussed thereon as a line of focus in the form of a segment of a line corresponding to the soldering line. The apparatus comprises a memory-operation section (A), a control section (B) and an actuation section (C), wherein the control section (B) performs upon receipt of commands from the memory-operation section (A) and governs the actuation section (C), so as to move the heat ray soldering head along the x- and/or y-coordinates on the substrate board to each preset position for the packaged IC chip to be soldered and so as to effect the soldering of each spot, where an electric junction is to be built up, by the heat ray focussed as a line of focus, under programmed control.

REFERENCES:
patent: 3632955 (1972-01-01), Cruickshank et al.
patent: 4110640 (1978-08-01), Ito
patent: 4278867 (1981-07-01), Tan
patent: 4390770 (1983-06-01), Kohler et al.

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