Apparatus for automatic baking treatment of semiconductor wafers

Heating – Work feeding – agitating – discharging or conveying...

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432 6, 432253, 432152, 414156, F27D 500

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active

047783826

ABSTRACT:
An apparatus for baking treatment of semiconductor wafers comprises a furnace portion and a conveyor portion. The furnace portion has a baking chamber in which is installed a turntable on which baking cassettes are supported during baking treatment and a mechanism for circulating hot air through the baking chamber. The conveyor portion has a conveyor mechanism which moves cassettes for transporting wafers along a path from an entrance to an exit of the conveyor portion, a transferring mechanism which can transfer wafers from a cassette for transporting wafers to a baking cassette and vice versa, and a cassette insertion and removal mechanism for inserting and removing a baking cassette from the baking chamber of the furnace portion and mounting it on and removing it from the turntable. The operation of the apparatus is controlled by a CPU in such a manner that immediately after the baking treatment is completed in the furnace portion, the baking cassette is removed from the furnace portion and the wafers contained therein are transferred to a transporting cassette which is maintained at ambient temperature to shorten the time required to cool the wafers.

REFERENCES:
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patent: 4439146 (1984-03-01), Sugita
patent: 4484538 (1984-11-01), Sarkozy et al.
patent: 4516897 (1985-05-01), Snider et al.
patent: 4518349 (1985-05-01), Tressler et al.
patent: 4523885 (1985-06-01), Bayne et al.
patent: 4610628 (1986-09-01), Mizushina

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