Television – Special applications – Manufacturing
Patent
1996-07-02
1999-01-19
Britton, Howard
Television
Special applications
Manufacturing
382150, H04N 718
Patent
active
058619097
ABSTRACT:
This invention provides a method and apparatus for automatically locating the bond of a wire to a lead frame and semiconductor chip or similar device as an in-process operation to facilitate in-process inspection. The apparatus includes a wire bonding machine, or similar apparatus, having a movable platform such as an X-Y table for holding semiconductor chips situated in lead frames; a video camera or other optical sensing or imaging device for generating images, which camera is typically positioned over the target chip and lead frame to be bonded; illumination means for illuminating the chip in a lead frame; an image processor capable of digitizing and analyzing the optically sensed images; a bonding mechanism; and a host controller connected to the bonding mechanism, the movable platform, the camera and the image processor. The apparatus generates and stores a pre-bond digital image of the semiconductor chip in the lead frame before bonding has occurred; connects one or more wires between the chip and lead frame by any of a number of means such as ultrasonic bonding, heat bonding, conductive glue bonding or other means; generates and stores a post-bond digital image of the now-bonded chip in its lead frame; registers the pre-bond and post-bond stored digital images so that analysis can be done; and permits inspection of the results of the wire bonds according to appropriate criteria.
REFERENCES:
patent: 4253111 (1981-02-01), Funk
patent: 4823394 (1989-04-01), Berkin
patent: 4899921 (1990-02-01), Bendat
Garakani Arman M.
Koljonen Juha
Britton Howard
Cognex Corporation
Weinzimmer Russ
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