Metal fusion bonding – Including means to apply flux or filler to work or applicator – By partial or total immersion of work or applicator into liquid
Patent
1996-08-19
1998-04-21
Heinrich, Samuel M.
Metal fusion bonding
Including means to apply flux or filler to work or applicator
By partial or total immersion of work or applicator into liquid
228 561, 228264, H05K 334, B23K 300
Patent
active
057409544
ABSTRACT:
A system is provided for selectively attaching or detaching a land grid array component to a surface of circuit board where the attachment is a grid array of solid conductive solder beads or balls. A chamber contains an inert liquid, and a heater heats the inert liquid to a temperature above the melting temperature of the solder beads. A fluid level adjustment means adjusts the level of the inert liquid in the chamber between a first level below the component and a second level above the component. A first mounting means supports the circuit board above the component, and a second mounting means is positioned at least partially in the container to support the component below the circuit board and to bias the component against the circuit board. An component/board assembly is positioned in the system. The beads are uniformly melted by raising the level of the inert liquid in the chamber to above the component to permit removal of the board. The beads of the grid array resolidify by lowering the level of the inert liquid in the chamber to below the component while the second mounting means biases the component against the circuit board, thereby reflowing the solder and establishing the solid conductive connections of the grid array.
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Bringewatt Allen Lee
Pai Deepak Keshav
General Dynamics Information Systems, Inc.
Heinrich Samuel M.
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