Apparatus for attaching adhesive tape to lead-on-chip leadframes

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With cutting – punching – piercing – severing – or tearing

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Details

156511, 156521, 156530, 156560, 156499, 156261, 156263, 156299, B32B 3100, H01L 2102

Patent

active

060125020

ABSTRACT:
An apparatus for attaching adhesive tape to a leadframe. The apparatus includes: a support frame; an adhesive tape on a reel mounted to the frame; a stationary cutter base mounted to the frame with an opening therethrough having a peripheral outline where the opening receives a leading terminal end of the tape and a portion of the tape following the leading terminal end, a channel in the base to guide the tape into the opening, and a block to hold the tape in the channel and in the opening; and a cutter which moves through the opening to cut a decal from the tape within the opening and to apply the decal to a leadframe. The cutter and the decal having an outline substantially matching the peripheral outline of the opening such that wasted tape is eliminated.

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