Apparatus for attaching a surface mount component

Details Apparatus for attaching a surface mount component Apparatus for attaching a surface mount component

1998-01-28

2000-04-25

Kincaid, Kristine

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

361760, 361777, 257692, 22818022, 439 83, H01R 909

Patent

active

060546530

ABSTRACT:
An apparatus (100) for attaching a surface mount component (102) includes a substrate (104) and a pad (106) carried on the substrate (104) to accommodate attachment of the surface mount component (102). The pad (106) has a central portion (108) and at least two triangular portions (109 and 110) separated by the central portion (108).

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patent: 5790386 (1998-08-01), Magee
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Technical Information: Solder Pad Geometry Studies For Surface Mount Of Chip Capacitors by Kent Wicker and John Maxwell, AVX Corporation, Corporate Research Laboratory, Myrtle Beach, SC 29577. 7 pgs. Presented at 1985 ECC.
Soldering, Assembly, vol. Jul./1990, pp. 173-182.
Preventing The Manhattan Effect: Certain dimensional relationships between solder lands and component metallizations must be observed to prevent the Manhattan Effect by Y. Anbe and T. Takahashi, Tamura Corporation, Tokyo, Japan. Electronic Packaging & Production, pp. 118-120, Feb. 1991.

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