Boots – shoes – and leggings
Patent
1997-03-05
1999-03-16
Thompson, Gregory
Boots, shoes, and leggings
257718, 361719, 361720, H05K 720
Patent
active
058837825
ABSTRACT:
An apparatus for removing heat from the top surface of an electronic package. In one embodiment, an electronic package is attached to the top-side of a printed circuit board. The printed circuit board has a first set of through holes positioned symmetrically about the electronic package. A heat sink is placed in thermal contact with the top surface of the electronic package. The heat sink has a second set of through holes that correspond and are align with the first set of through holes. Posts having a first end portion and a second end portion are positioned within the first and second set of through holes such that the first end portions are in abutting engagement with the top surface of the heat sink, and the second end portions protrude from the bottom-side of the printed circuit board. The heat sink is held in place by a spring clip. The spring clip includes a substantially flat cross member and a pair of legs extending outward from either side of the cross member. Each of the legs terminate at a flange section. The flange section of each leg has an opening for receiving the second end portion of a post. Attachment of the heat sink to the electronic package is accomplished by positioning the spring clip over the bottom-side of the printed circuit board such that the cross member is positioned substantially centered in one direction with respect to the electronic package mounted on the top-side surface of the board. Once the spring clip is properly positioned, the spring clip legs are compressed such that the second end portions of the post are disposed and secured within the flange openings of the clip.
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Thurston Mark Edward
Xie Hong
Intel Corporation
Thompson Gregory
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