Apparatus for assembling semiconductor devices

Details Apparatus for assembling semiconductor devices Apparatus for assembling semiconductor devices

1990-01-04

1991-01-08

Heinrich, Sam

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Wire lead bonder

228103, 7386391, 738656, 1983391, 1983462, H01L 2158, H01L 2160

Patent

active

049827286

ABSTRACT:
An apparatus for assembling semiconductor devices includes a transportation line for transporting partially fabricated articles such as lead frames with a semiconductor chip mounted thereon; a working unit disposed in the transportation line for processing the partially fabricated articles by wire bonding or die bonding; an inspection unit disposed separately from the transportation line; a delivery unit for extracting a processed article from the transportation line, moving the extracted worked article to an inspection section and returning the processed article to the transportation line after checking; and a stock unit for stocking the processed articles. In the inspection section, one of the processed articles selected for sampling inspection is placed on a support and is checked with a microscope. During checking, the support and the microscope can be moved relative to each other to enable observation of the whole of the selected article.

REFERENCES:
patent: 3310216 (1967-03-01), Kollner et al.
patent: 3878726 (1975-04-01), Hamatani
patent: 4301958 (1981-11-01), Hatakenaka et al.
patent: 4607536 (1986-08-01), Lawson et al.
patent: 4696104 (1987-09-01), Vanzetti et al.
patent: 4801234 (1989-01-01), Cedrone
Hitachi Tokyo Electronics Company, "Automatic Through Line Assembling System", p. 12.
Hitachi Tokyo Electronics Company, "Flexible Through Line Assembling System", p. 13.

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