Apparatus for assembling and resin-encapsulating a heat sink-mou

Plastic article or earthenware shaping or treating: apparatus – Distinct means to feed – support or manipulate preform stock... – Opposed registering coacting female molds

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Details

249 91, 249 95, 26427217, 425117, 425544, 425DIG228, B29C, B29C 4514

Patent

active

053705173

ABSTRACT:
A die-stamped frame is fastened to a heat sink metal baseplate by wedging flexible tabs into receiving indentations of the baseplate while keeping the frame substantially in contact with the surface of the baseplate. The wire welding operations may then take place on the end of the fingers of the patterned metal frame while the same are solidly resting on the surface of the baseplate thus facilitating the welding. The backing-off of the metal frame from the surface of the heat sink baseplate takes place upon the closing of the mold used for encapsulating in resin the device. The injection of the resin and its solidification "freezes" the pins in the backed-off position imposed by the mold upon closing, thus ensuring the electrical isolation between the pins and the integral heat sink baseplate.

REFERENCES:
patent: 3930114 (1975-12-01), Hodge
patent: 4215360 (1980-07-01), Eytcheson
patent: 4451973 (1984-06-01), Tateno et al.
patent: 4890152 (1989-12-01), Hirata et al.
patent: 4954307 (1990-09-01), Yokoyama
patent: 5044912 (1991-09-01), Billings et al.
patent: 5105259 (1992-04-01), McShane et al.

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