Apparatus for applying solder masking to a circuit board

Details Apparatus for applying solder masking to a circuit board Apparatus for applying solder masking to a circuit board

1985-09-24

1988-04-12

Beck, Shrive P.

Coating apparatus

Control means responsive to a randomly occurring sensed...

Responsive to condition of coating material

118300, 118302, B05B 1208

Patent

active

047367040

ABSTRACT:
In accordance with one embodiment of the invention, solder masking material is pressurized by means of a fluid pump to approximately 250 psi and high speed valve is used to turn the flow on and off rapidly in order that small "shots" of fluid are propelled from a tip, through the air, to selected portions of a circuit board. The selected areas of the circuit board to be masked are situated oppositely from the tip , as by a XY positioning system for the tip and/or the circuit board. The drops of masking material, which form upon impinging of the shots onto the circuit board, may be varied in volume and diameter. Where needed, a continuous bead of masking material may be formed on the circuit board by spacing the dots sufficiently close together.

REFERENCES:
patent: 3298030 (1967-01-01), Lewis
patent: 3876144 (1975-04-01), Madda
patent: 4059708 (1977-11-01), Heiss
patent: 4132357 (1979-01-01), Blockinton
patent: 4542710 (1985-09-01), Nakayama
patent: 4560584 (1985-12-01), Henninger
Kuhn; "Ink-Jet Printing", Scientific American, Apr. 1979, pp. 162-178.

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