Coating apparatus – With vacuum or fluid pressure chamber – With means to apply electrical and/or radiant energy to work...
Patent
1989-01-09
1990-05-15
Hoag, Willard
Coating apparatus
With vacuum or fluid pressure chamber
With means to apply electrical and/or radiant energy to work...
118634, 118642, 118 58, B05C 1102, B05C 1114, B05C 502, B05C 906
Patent
active
049248006
ABSTRACT:
Disclosed are improved method and apparatus by which the adhesion of a photo-resist applied onto a wafer substrate can be improved when using an adhesion reinforcing agent in combination. The method of applying a photo-resist according to the present invention comprises a steps of washing the substrate, a step of drying said substrate, a step of feeding an adhesion reinforcing agent to said substrate while heating it to a prescribed temperature, a step of carrying out additional heating in the state that the adhesion reinforcing agent is stopped from being fed to said substrate, a stop of cooling said substrate to a room temperature, and a step of coating the surface of said substrate with the photo-resist.
REFERENCES:
patent: 3549368 (1970-12-01), Collins et al.
patent: 3705055 (1972-12-01), Christensen et al.
patent: 4197344 (1980-04-01), Tshudy
patent: 4238559 (1980-12-01), Feng et al.
patent: 4520750 (1985-06-01), Mansour
patent: 4564584 (1986-01-01), Fredericks et al.
patent: 4592926 (1986-06-01), Rubin et al.
patent: 4608943 (1986-09-01), Doehler et al.
patent: 4686173 (1987-08-01), Kanamori et al.
Dainippon Screen Mfg. Co,. Ltd.
Hoag Willard
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