Apparatus for applying materials to substrates

Details Apparatus for applying materials to substrates Apparatus for applying materials to substrates

1998-11-12

2000-04-18

Edwards, Laura

Coating apparatus

Control means responsive to a randomly occurring sensed...

Responsive to attribute, absence or presence of work

118679, 118682, 118684, 118696, 118702, 118703, 118712, 118 13, 118 25, 118 27, 222503, 994501, B05C 500

Patent

active

060510706

ABSTRACT:
An apparatus for applying a material to a substrate. A material application station includes a shutter assembly having at least one horizontally extending blade which is rapidly displaceable from a closed configuration in which an outlet path of the shutter assembly is obstructed to an open configuration in which the outlet path is open. While the blade of the shutter assembly is in the closed configuration, a coating material is applied to a first predetermined area on an upper surface of the shutter assembly. A substrate is located beneath the shutter assembly in the outlet path. The blade of the shutter assembly is rapidly opened so that the coating material falls onto the substrate over a second predetermined area on an upper surface of the substrate. The second predetermined area is substantially equal to the first predetermined area. The resulting deposit is of a controlled diameter. A rapid opening of the blade allows the deposit to fall a short distance onto a substrate such as a pizza base.

REFERENCES:
patent: 1032190 (1912-07-01), Crosby
patent: 4152976 (1979-05-01), Kawasaki et al.

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