Metal fusion bonding – Including means to apply flux or filler to work or applicator
Patent
1992-08-18
1994-07-12
Bradley, Paula A.
Metal fusion bonding
Including means to apply flux or filler to work or applicator
228 43, 118687, B23K 3700
Patent
active
053280857
ABSTRACT:
A dispensing apparatus for applying a thin stream of flux to a surface of a printed circuit board. The dispensing head travels at a high rate of speed relative to the board during the dispensing of flux to apply thin layers of flux thereto. Preferably, the dispensing head moves transversely to the work path of a conveyor that transports the board through a flux station, at a rate of approximately 20 to 90 inches per second. Tips that dispense the flux are angularly disposed relative to the board and, if desired, make multiple passes over the surface to coat selected regions twice. Either the board is incrementally advanced through the flux station or the dispensing head is incrementally advanced relative to the board so that flux is applied when the board is stationary.
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Stoops Bradley N.
Stoops Melaney S.
Bradley Paula A.
Elpel Jeanne M.
Precision Dispensing Equipment, Inc.
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