Apparatus for applying fluid, pasty or plastic substances to a s

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With means applying wave energy or electrical energy...

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15624411, 15624417, 15624423, 15624424, 15624427, 1562722, 1562728, 1562737, 1563797, 1565831, 1565835, 118 68, 118202, 118302, 118323, 118325, B29C 4706

Patent

active

051222191

ABSTRACT:
In a method of applying fluid, pasty or plastic substances, especially thermoplastics, to a substrate, the substance is melted, heated and applied via an outlet slit of a perforated cylinder to the substrate, the substrate then being lifted off from the cylinder. Provision is made here for the cylinder (3) to be connected to an energy source (17) and to be designed itself as a heat source for the substance.

REFERENCES:
patent: 3460513 (1969-08-01), Hessel
patent: 3883386 (1975-05-01), Garbini et al.
patent: 3930923 (1976-01-01), Elliott
patent: 4671205 (1987-06-01), Billeter
patent: 4938835 (1990-07-01), Ludwig

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