Apparatus for applying dielectric or metallic materials

Details Apparatus for applying dielectric or metallic materials Apparatus for applying dielectric or metallic materials

1988-11-14

1991-12-10

Beck, Shrive

Coating apparatus

With means to apply electrical and/or radiant energy to work...

Electrostatic and/or electromagnetic attraction or...

118718, 118723, 118726, 118727, 427 38, 427 47, 427 50, C23C 1650

Patent

active

050708112

ABSTRACT:
In an apparatus for applying dielectric or metallic substances, such as silicon dioxide, for example, to a substrate (15) disposed in a vacuum chamber (16, 17), the apparatus having an electron emitter (9) and having solenoid coils (30, 42) disposed in the area of the vacuum chamber, the electron emitter (9) is disposed in a separate generator chamber (37) forming the anode (11) and communicating with the vacuum chamber (17), so that, after the process gas is introduced into the generator chamber (37) a large-area plasma jet (8) is produced which is guided by the action of magnets (6, 20, 30, 42) between the electron emitter (9) and a melting furnace (7) disposed in the vacuum chamber (17), while the vapor stream issuing from the melting furnace (7) is accelerated and reaches the substrate (15) as activated vapor.

REFERENCES:
patent: 3898952 (1975-08-01), Shirahata et al.
patent: 3916034 (1975-10-01), Tsuchimoto
patent: 3935412 (1976-01-01), McDonough et al.
patent: 4016389 (1977-04-01), White
patent: 4197175 (1980-04-01), Moll et al.
patent: 4254159 (1981-03-01), Pulker et al.
patent: 4301391 (1981-11-01), Seliger et al.
patent: 4339691 (1982-07-01), Morimiya et al.
patent: 4362767 (1982-12-01), Nouchi et al.
patent: 4683838 (1987-08-01), Kimura et al.
patent: 4739170 (1988-04-01), Varga
patent: 4805555 (1989-02-01), Itoh
patent: 4812326 (1989-03-01), Tsukazaki et al.
patent: 4885070 (1989-12-01), Campbell et al.
DaSilva, E. M. and P. White, "Fabrication of Aluminum Oxide Films", IBM Technical Disclosure Bulletin, vol. 4, No. 6 (Dec. 1961) p. 6.
Preparation of Si.sub.3 N.sub.4 Coatings, Journal Vac. Sci. Tech., vol. 12, No. 4, pp. 821-825 (1975).
Ion Plating in a System with a Hot Cathode, J. Vac. Sci. Tech. 41(2) Apr.-Jun. 1983, pp. 241-243.
High-Rate Vapor Deposition and Large Systems, Journal Vac. Sci. Tech. A5(4) Jul.-Aug. 1987, p. 2239.
Plasma Surface Interaction . . . , Goebel, Campbell, and Conn, Journal of Nuclear Materials, vol. 121, pp. 277-282 (1984).

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