Apparatus for applying and removing protective adhesive tape to/

Details Apparatus for applying and removing protective adhesive tape to/ Apparatus for applying and removing protective adhesive tape to/

1992-05-07

1994-05-10

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

Automatic and/or material-triggered control

156344, 156584, 156566, 156571, 156522, 156261, 156267, 29 2501, B26D 500, B32B 3118

Patent

active

053104420

ABSTRACT:
A single wafer transport mechanism takes a semiconductor wafer out of a cassette loader, and transports the wafer to a single wafer positioning mechanism for placing the wafer in position. When applying a protective adhesive tape to a surface of the wafer, the transport mechanism transports the wafer placed in position to a tape applying mechanism. When removing the protective tape from the wafer surface, the transport mechanism transports the wafer to a tape removing mechanism which removes the protective tape from the wafer surface by using a remover adhesive tape having a strong adhesion. The wafer having the protective tape applied thereto or stripped of the protective tape is transported back to a cassette by the wafer transport mechanism.

REFERENCES:
patent: 4481067 (1984-11-01), Off
patent: 4631103 (1986-12-01), Ametani
patent: 4775438 (1988-10-01), Funakoshi
patent: 4865677 (1989-09-01), Matsushita
patent: 4925515 (1990-05-01), Yoshimura
patent: 5009735 (1991-04-01), Ametani
patent: 5067218 (1991-11-01), Williams
patent: 5106450 (1992-04-01), Freisitzer
Patent Abstracts of Japan, Publication No. 2-091959.
Patent Abstracts of Japan, Publication No. 2-081456.
Patent Abstracts of Japan, Publication No. 60-85536.

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