Coating apparatus – With vacuum or fluid pressure chamber
Patent
1977-08-10
1979-05-29
Mackey, Robert
Coating apparatus
With vacuum or fluid pressure chamber
118 8, 118313, 118DIG3, 53383, 93 36MM, 427285, 427286, B05C 1100
Patent
active
041563980
ABSTRACT:
Hot melt adhesive is applied to a moving substrate in a pattern including at least two lines which extend transversely to one another, by conveying the substrate past a nozzle orifice through which a first line of molten adhesive is applied, as by extrusion, to the substrate parallel to the direction of substrate movement and, while continuing to move the substrate in the same direction, projecting another portion of the molten hot melt adhesive onto the substrate as a burst in the form of a flat sheet issuing from a fan spray orifice, this orifice being oriented so that the sheet is projected transversely to the direction of substrate movement, and terminating the burst so rapidly that the adhesive so projected is deposited on the moving substrate in the form of a line having a length in the crosswise direction that is several times its width.
REFERENCES:
patent: 2864549 (1958-12-01), Hayward et al.
patent: 3152923 (1964-10-01), Marshall et al.
patent: 3327680 (1967-06-01), Talbot
patent: 3340847 (1967-09-01), Miller et al.
patent: 3425393 (1969-02-01), Shuh et al.
patent: 3595204 (1971-07-01), McIntyre et al.
patent: 3645815 (1972-02-01), Bedore
patent: 3682131 (1972-08-01), Algeri et al.
patent: 3831342 (1974-08-01), Rejsa
patent: 4059466 (1977-11-01), Scholl et al.
Mackey Robert
Nordson Corporation
LandOfFree
Apparatus for applying a hot melt adhesive pattern to a moving s does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Apparatus for applying a hot melt adhesive pattern to a moving s, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for applying a hot melt adhesive pattern to a moving s will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-228232