Presses – With additional treatment of material – Separating materials
Patent
1996-05-29
1998-04-07
Gerrity, Stephen F.
Presses
With additional treatment of material
Separating materials
100 99, 100266, 10026921, 156382, B30B 900, B30B 1500
Patent
active
057351961
ABSTRACT:
An apparatus for applying a force to laminated integrated circuit cubes in an oven chamber includes a force-applying member, an actuator for the force-applying member, and sealing structure for sealing the force-applying member to an opening permitting access by said force-applying member into the oven chamber. The sealing structure has a flexible sleeve, and the force-applying member passes through the sleeve. A first end of the sleeve is hermetically sealed to the force-applying member, and a second end of the sleeve can be hermetically sealed about the opening. The force applying member can move within the opening and the flexible sleeve will flex with this movement.
REFERENCES:
patent: 2351058 (1944-06-01), Marks
patent: 2354692 (1944-08-01), Marks
patent: 4646128 (1987-02-01), Carson et al.
patent: 4672737 (1987-06-01), Carson et al.
patent: 4689105 (1987-08-01), Fazlin et al.
patent: 4704319 (1987-11-01), Belanger et al.
patent: 4706166 (1987-11-01), Go
patent: 4764846 (1988-08-01), Go
patent: 4983533 (1991-01-01), Go
patent: 5045685 (1991-09-01), Wall
patent: 5104820 (1992-04-01), Go et al.
patent: 5218515 (1993-06-01), Bernhardt
patent: 5241450 (1993-08-01), Bernhardt et al.
patent: 5279991 (1994-01-01), Minahan et al.
patent: 5347428 (1994-09-01), Carson et al.
patent: 5389346 (1995-02-01), Copeland, Jr.
patent: 5424920 (1995-06-01), Miyake
patent: 5432318 (1995-07-01), Minahan
patent: 5432729 (1995-07-01), Carson et al.
Jordan Stanley Robert
Stewart Gary Leon
Trollinger Ralph
Gerrity Stephen F.
IBM Corporation
LandOfFree
Apparatus for applying a force to laminated integrated circuit d does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Apparatus for applying a force to laminated integrated circuit d, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for applying a force to laminated integrated circuit d will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4730