Apparatus for application to a circuit board

Details Apparatus for application to a circuit board Apparatus for application to a circuit board

1995-06-05

1997-06-10

Le, Long V.

Coating apparatus

Immersion or work-confined pool type

With means for moving work through, into or out of pool

118 57, 118400, 118402, 118403, 118423, 118429, B06B 120

Patent

active

056371497

ABSTRACT:
Solder is applied to a circuit structure 7 by dipping the structure into a bath 1 of molten solder 3, the molten solder having a layer of oil 5 on top. The structure is dipped into the bath by rotating it along a path that is substantially coplanar with the circuit structure. This is achieved by supporting the structure on a carrier 9 which in turn is attached to a motor shaft 11.

REFERENCES:
patent: 3661638 (1972-05-01), Lemecha
patent: 3859722 (1975-01-01), Kinsky et al.
patent: 3945618 (1976-03-01), Shoh
patent: 4592944 (1986-06-01), Clark et al.
patent: 4637541 (1987-01-01), Tanny
IBM Technical Disclosure Bulletin, vol. 18, No. 10, Mar. 1976, pp. 3182-3183.
IBM Technical Disclosure Bulletin, vol. 24, No. 11A Apr. 1982, p. 5726.
IBM Technical Disclosure Bulletin, vol. 27, No. 1A, Jun. 1984, "Vibration Soldering Equipment", by J. L. Backes et al., pp. 71-72.
3114665 (Japan) May 15, 19911 Abstract.
2050492 Feb. 20, 1990 (Japan) Abstract.

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