Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Indefinite or running length flexible strand – rod – tube – or...
Reexamination Certificate
2005-04-26
2005-04-26
Haran, John T. (Department: 1733)
Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
Indefinite or running length flexible strand, rod, tube, or...
C156S511000, C156S517000, C156S521000
Reexamination Certificate
active
06883574
ABSTRACT:
A method and apparatus for application of adhesive tape to semiconductor devices are disclosed. A first adhesively coated tape material length is supplied to a first die associated with a cutting and application mechanism. A second length of adhesively coated tape material is also provided to a second die of the cutting and application mechanism. A plurality of LOC leadframes is supplied sequentially through the application structure to apply a first decal cut from the first tape material to a first die site at a first location and to apply a second decal cut from the second tape material to a second die site at a second location.
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Haran John T.
TraskBritt
LandOfFree
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