Apparatus for annealing, method for annealing, and method...

Details Apparatus for annealing, method for annealing, and method... Apparatus for annealing, method for annealing, and method...

2006-06-23

2008-10-28

Nhu, David (Department: 2818)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

By electromagnetic irradiation

C438S467000, C438S663000, C438S553000, C257SE21170, C257SE21051, C257SE21134, C257SE21328, C257SE21347

Reexamination Certificate

active

07442625

ABSTRACT:
An apparatus for annealing a substrate includes a substrate stage having a substrate mounting portion configured to mount the substrate; a heat source having a plurality of heaters disposed under the substrate mounting portion, the heaters individually preheating a plurality areas defined laterally in the substrate through a bottom surface of the substrate; and a light source facing a top surface of the substrate, configured to irradiate a pulsed light at a pulse width of about 0.1 ms to about 100 ms on the entire top surface of the substrate.

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patent: 2002-057301 (2002-02-01), None
patent: 2002-252174 (2002-09-01), None

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