Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering
Patent
1984-05-17
1986-06-17
Demers, Arthur P.
Chemistry: electrical and wave energy
Apparatus
Coating, forming or etching by sputtering
204192R, 204192M, C23C 1500
Patent
active
045954828
ABSTRACT:
A cathode sputter magnetron device is controlled so that there is a uniformity of material supplied to workpieces over the lives of plural geometrically spaced targets from which material is sputtered. Each target is subjected to a separate plasma discharge that is confined to the associated target by a separate magnetic field. The relative powers of the separate plasma discharges are controlled so that the relative powers change as a function of target erosion condition. The impedances of the separate discharges are controlled by varying each separate magnetic field in response to variable currents applied to electromagnets.
REFERENCES:
patent: 4265729 (1981-05-01), Morrison
patent: 4362611 (1982-12-01), Logan et al.
patent: 4389299 (1983-06-01), Adachi et al.
patent: 4392939 (1983-07-01), Crombeen et al.
patent: 4401539 (1983-08-01), Abe et al.
patent: 4407713 (1983-10-01), Zega
patent: 4415427 (1983-11-01), Hidler et al.
patent: 4422916 (1983-12-01), McKelvey
patent: 4431505 (1984-02-01), Morrison
patent: 4434038 (1984-02-01), Morrison
patent: 4441974 (1984-04-01), Nishikawa
patent: 4461688 (1984-07-01), Morrison
Cole Stanley Z.
Demers Arthur P.
Varian Associates Inc.
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