Metal working – Means to assemble or disassemble – With signal – scale – illuminator – or optical viewer
Patent
1988-03-21
1989-01-17
Goldberg, Howard N.
Metal working
Means to assemble or disassemble
With signal, scale, illuminator, or optical viewer
29740, 29743, 29759, 29833, H05K 1304
Patent
active
047979941
ABSTRACT:
Apparatus for and methods of bonding electrical components or semiconductor chips to a substrate or lead frame is disclosed. According to the present invention, a sawn semiconductor wafer is held upside down in a first substantially horizontal plane and the substrate or lead frame to which it is to be bound is held in a second plane which is below and substantially parallel to the first plane. A die eject head located above the sawn wafer cooperates with a die bond head located between the wafer and the substrate to remove an individual die from the sawn wafer. The die bond head then rotates about an axis which is parallel to both planes and places the die on the lead frame. Also included is a transducer means which is responsive to electrical stimulus for actuating the die eject head and the die bond head such that the interactive force between the heads and the component may be precisely controlled. A die locating system which is located at least in part between the first and second planes, is also provided for producing an image of the candidate die to be transferred. The configuration of the die bond head in combination with the mode of operation of the die bonding apparatus allows efficient operation of the die locating system.
REFERENCES:
patent: 3632955 (1972-01-01), Cruickshank et al.
patent: 4372802 (1983-02-01), Harigone et al.
patent: 4498023 (1985-02-01), Stout
patent: 4587703 (1986-05-01), Azizi et al.
patent: 4733459 (1988-03-01), Tateno
Automatic Die Attach Sketch, Jade Corp.
"Dieattach Model 7500", Jade Corporation, 1982.
Sketch of Jade Apparatus.
Graham James H.
Michaud Gerard H.
Stout Roger P.
Goldberg Howard N.
Kulicke & Soffa Industries Inc.
Ross Taylor J.
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