Apparatus for and methods of die bonding

Details Apparatus for and methods of die bonding Apparatus for and methods of die bonding

1988-03-21

1989-10-31

Rosenbaum, Mark

Metal working

Method of mechanical manufacture

Electrical device making

29709, 29740, 29743, 29759, H05K 1304

Patent

active

048767913

ABSTRACT:
This invention relates to apparatus for and methods of bonding a component to a substrate. More particularly, this invention relates to apparatus for and methods of removing small components, such a dies or other electrical components, from a wafer and bonding the components to a substrate.

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