Electric heating – Heating devices – Combined with container – enclosure – or support for material...
Patent
1998-05-27
2000-06-27
Paik, Sang
Electric heating
Heating devices
Combined with container, enclosure, or support for material...
118724, H05B 368, C23C 1600
Patent
active
060809698
ABSTRACT:
A substrate thermal processing apparatus easily changes a set temperature at which a substrate is set while thermally processed. A heating plate of the substrate thermal processing apparatus comprises a substrate supporting plate which supports a substrate, an auxiliary heating portion and a main heating portion, and a cooling Peltier element and a water cooling jacket. For heating a substrate, heat which is generated at the main heating portion which comprises a heater portion is transmitted to the substrate supporting plate through the auxiliary heating portion which comprises a Peltier element, so that the substrate is heated up. When the temperature of the substrate supporting plate is to be decreased, the auxiliary heating portion and the cooling Peltier element guide the heat of the substrate supporting plate to the water cooling jacket, and the heat is discharged outside by cooling water.
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patent: 5084671 (1992-01-01), Miyata et al.
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patent: 5216887 (1993-06-01), Kadotani et al.
patent: 5854468 (1998-12-01), Muka
patent: 5927077 (1999-07-01), Hisai et al.
Goto Hiroyasu
Hisai Akihiro
Kobayashi Hiroshi
Matsunaga Minobu
Dainippon Screen Mfg. Co,. Ltd.
Paik Sang
SMC Corporation
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