Apparatus for and method of processing substrate

Details Apparatus for and method of processing substrate Apparatus for and method of processing substrate

2008-09-10

2011-10-25

MacArthur, Sylvia R. (Department: 1716)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

For liquid etchant

C156S345110, C156S345130, C156S345210

Reexamination Certificate

active

08043468

ABSTRACT:
A substrate processing apparatus discharges a hydrofluoric acid solution from discharge nozzles toward grooves formed in side walls of an inner bath. The hydrofluoric acid solution discharged from the discharge nozzles impinges upon the grooves to diffuse, thereby moving toward a top portion of the inner bath in the form of low-speed uniform liquid flows. Thus, a metal component and foreign substances generated in the inner bath float up toward the top portion of the inner bath without being agitated within the inner bath, and are rapidly drained to an outer bath together with the hydrofluoric acid solution.

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Decision to Grant issued by Korean Patent Office on Aug. 23, 2010 in connection with corresponding Korean application No. 10-2008-0090369.
Office Action issued by Korean Patent Office on May 27, 2010 in connection with corresponding Korean patent application No. 10-2008-0090369.
English translation of relevant portions of Korean Office Action issued May 27, 2010.
Chinese Office Action dated Dec. 18, 2009 with English translation.

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