Apparatus for and method of packaging semiconductor devices

Details Apparatus for and method of packaging semiconductor devices Apparatus for and method of packaging semiconductor devices

2005-12-20

2005-12-20

Schillinger, Laura M. (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

Reexamination Certificate

active

06977191

ABSTRACT:
A carrier and package for plural semiconductor devices includes a member with device-conformal apertures therethrough. A first removable cover is attached to one side of the member to close one end of each aperture. After devices are inserted into the apertures with their first ends “up” and their second ends “down,” a second removable cover is attached to the other side of the member to close the other end of each aperture. After inverting the assembly, removal of the first cover presents the devices in the apertures with their second ends “up” and their first ends “down.”

REFERENCES:
patent: 4456359 (1984-06-01), Turner
patent: 5427492 (1995-06-01), Tanaka et al.
patent: 5848702 (1998-12-01), Pakeriasamy
patent: 6273310 (2001-08-01), Gregory

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