Metal working – Barrier layer or semiconductor device making
Patent
1995-12-13
1998-12-01
Graybill, David
Metal working
Barrier layer or semiconductor device making
438112, 438113, 26427217, H01L 2156, H01L 2158, H01L 2160, H01L 2170
Patent
active
058422579
ABSTRACT:
A process wherein a lead frame into which a plurality of semiconductor devices are integrated is first supplied to a press unit (21) among three press units (21 to 23) for cutting, to be cut into the respective semiconductor devices. Thereafter the lead frame is successively fed to the press units (22, 23) in the units of the semiconductor devices due to the action of an internal conveyor (33a), thereby being subjected to cutting stepwise. Thus, the press units (21 to 23) are provided at wide spaces, whereby press motors (85a to 85c) requiring high outputs are independently set for the respective press units (21 to 23). Further, the process does not vary the space between molds with the product pitch of the lead frame. Working is enabled by the press motors which are provided for the respective press units. The process copes with various types of semiconductor devices because the space between the molds may not be changed.
REFERENCES:
patent: 4624358 (1986-11-01), Satou
patent: 5032542 (1991-07-01), Kazami et al.
patent: 5614441 (1997-03-01), Hosokawa et al.
patent: 5637273 (1997-06-01), Goo
Aoki Hideji
Tashima Takahiro
Graybill David
Mitsubishi Denki & Kabushiki Kaisha
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