Apparatus for and method of desoldering and removing an integrat

Details Apparatus for and method of desoldering and removing an integrat Apparatus for and method of desoldering and removing an integrat

1983-11-03

1986-02-11

Ramsey, Kenneth J.

Metal fusion bonding

Process of disassembling bonded surfaces, per se

228 20, 228 37, 228 561, B23K 300

Patent

active

045694737

ABSTRACT:
Apparatus for and method of desoldering and removing a soldered together integrated circuit from a mounting member and for cleaning the same in which the integrated circuit and the mounting member are placed in tension in preparation of separating the same so that when the securing solder is melted the integrated circuit and mounting member separate from each other. The integrated circuit and mounting member are subjected to a pressurized flow of fluid which bathes the integrated circuit in an enclosure that is completed by the mounting member so that the mounting member and the integrated circuit are cleaned of solder and are also cooled.

REFERENCES:
patent: Re3575 (1869-08-01), Miller
patent: 3004505 (1961-10-01), Dvorak
patent: 3644980 (1972-02-01), Class, Jr.
patent: 3661315 (1972-05-01), Helton
patent: 4022370 (1977-05-01), Durney
patent: 4456163 (1984-06-01), Zach
Baron, IBM Technical Disclosure Bulletin, vol. 20, No. 8, Jan., 1978, pp. 3028-3029.

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