Apparatus for and method of controlling sputter coating

Details Apparatus for and method of controlling sputter coating Apparatus for and method of controlling sputter coating

1983-12-27

1985-02-19

Demers, Arthur P.

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

204192R, 204192M, C23C 1500

Patent

active

045004080

ABSTRACT:
The magnetic field of a magnetron sputter coating apparatus is controlled in response to measurements of plasma parameters to control deposition parameters, such as sputter deposition rate and material deposition thickness profile. From time to time the apparatus is standardized to change preset values for parameters of the plasma to manage the deposition parameters.

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Advances in High Rate Sputtering with Magnetron-Plasmatron Processing and Instrumentation, San Diego, Calif., Apr. 27, 1979, Schiller et al., pp. 455-467.

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