Apparatus for and method of checking external appearance of sold

Optics: measuring and testing – By polarized light examination – With light attenuation

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356237, G01B 1124, G01N 2100

Patent

active

051929830

ABSTRACT:
A laser beam is projected from above toward a solder fillet for bonding the corresponding one of leads of an electronic component to a circuit board. The laser beam is reflected by the solder fillet, and the reflected beam is received by light receiving means disposed above and aslant the leads, thereby to measure a shape of the solder fillet.

REFERENCES:
Geise et al, "A Laser Scaner for PC Board Inspection," Electronic Packaging and Production, vol. 20, #12, Dec. 1980.

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