Abrading – Precision device or process - or with condition responsive... – Computer controlled
Reissue Patent
2007-01-16
2007-01-16
Nguyen, George (Department: 3723)
Abrading
Precision device or process - or with condition responsive...
Computer controlled
C451S041000, C451S285000, C451S287000, C451S286000, C451S288000, C451S289000, C451S388000
Reissue Patent
active
10976330
ABSTRACT:
A polishing apparatus for polishing a workpiece such as a semiconductor wafer has a turntable with a polishing surface, and a top ring for holding a workpiece and pressing the workpiece against the polishing surface under a first pressing. The polishing apparatus has a pressurized fluid source for supplying pressurized fluid, and a plurality of openings provided in the holding surface of the top ring for ejecting the pressurized fluid supplied from the pressurized fluid source. A plurality of areas each having the openings are defined on the holding surface so that the pressurized fluid is selectively ejectable from the openings in the respective areas.
REFERENCES:
patent: 4270316 (1981-06-01), Kramer et al.
patent: 4373991 (1983-02-01), Banks
patent: 5036630 (1991-08-01), Kaanta et al.
patent: 5486129 (1996-01-01), Sandhu et al.
patent: 5584751 (1996-12-01), Kobayashi et al.
patent: 5605488 (1997-02-01), Ohashi et al.
patent: 5643053 (1997-07-01), Shendon
patent: 5651724 (1997-07-01), Kimura et al.
patent: 5670011 (1997-09-01), Togawa et al.
patent: 5795215 (1998-08-01), Guthrie et al.
patent: 5908530 (1999-06-01), Hoshizaki et al.
patent: 5941758 (1999-08-01), Mack
patent: 6024630 (2000-02-01), Shendon et al.
patent: 401109966 (1989-04-01), None
patent: 401216768 (1989-08-01), None
patent: 404217456 (1992-08-01), None
patent: 6-333891 (1994-12-01), None
U.S. Pat. application Ser. No. 08/524,824, filed Sep. 7, 1995, Kimura et al., entitled “Method and Apparatus for Polishing Workpiece”.
Kimura Norio
Nakashiba Masamichi
Watanabe Isamu
Yoshida Kaori
Ebara Corporation
Nguyen George
Wenderoth , Lind & Ponack, L.L.P.
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